- Placement area
- max. 400x500mm
- Component range
- from 0402 to 30x30 ( option 40x40mm )
- min pitch 0,4mm
- components packgage
- tapes / sticks / trays
- Components centering
- non-contact alignment
- Placement rate
- up to 2000 cph.
- Feeder capacity
- up to 80 x 8mm - automatic tape feeder
- and 2 x (300 x 200mm) - IC-tray
- with 200 x 300mm PCB size
- Resolution
- X / Y - axis - 0,008mm ( linear encoder )
- Z - axis : 0,02mm ( linear encoder )
- Rotation : 0,01° ( rotation encoder )
- Placement accuracy
- +/- 0,03mm
- Dimensions and weight
- 1100 x750 x 1300 mm / ca. 135 kg
- Supply
- 230V-50Hz -650W / 0,6 MPa - min. 20 l/min
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- Precision full vision SMT pick and place machine
- automatic pick & place head
- automatic control of compressive force
- automatic nozzle changer ( 6 tools )
- top camerasystem for automatic fiducial
- bottom camerasystem for touchless components centering
- Gerber - and CAD editor (all CAD-systems )
- teach-in mode - electronic manipulator
- intelligent feeder system - CAN Bus
- vision inspektion of printing accuracy of solder paste and accuracy of component placement
- operating system: Windows XP
- control panel: PC keybord / Mouse
- remote service via internet
- Application area
- suitable for small and medium volume production
- qualified for pick & place of standard and fine pitch components
- incl. SOIC, PLCC, BGA , µBGA, CSP, QFN ,LED
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