- Placement area
- max. 400x500mm
- Component range
- from 0402 to 40x40
- min pitch 0,3mm
- BGA / µBGA
- components packgage
- tapes / sticks / trays / bulk
- Components centering
- non-contact alignment
- Placement rate
- up to 3000 cph.
- Feeder capacity
- max 80 x 8mm - automatic tape feeder
- and 2 x (300 x 200mm) - IC-tray
- with 200 x 300mm PCB size
- Resolution
- X / Y Axis - 0,008mm - linear encoder
- Placement accuracy
- +/- 0,03mm
- Dimensions and weight
- 1100 x 750 x 1300 mm / ca. 145 kg
- Supply
- 230V-50Hz -350W / 0,6 MPa - 25l/min
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- full vision automatic SMT pick and place machine
- 2 automatic pick & place heads
- automatic control of compressive force
- automatic nozzle changer (2x6 tools)
- top camerasystem for automatic fiducial
- bottom camerasystem for touchless components centering
- Gerber - and CAD editor ( all CAD-systems )
- intelligent feeder system - CAN Bus
- operating system: Windows XP
- control panel: PC keybord / Mouse
- user interface - PC and 17 LCD monitor
- Application area
- suitable for small and medium volume production
- qualified for pick & place of standard and fine pitch components
- incl. BGA ,µBGA, QFN
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