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RK180 Reflow oven    Reflow oven   
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Reflow oven RK160



  • Reflow oven RK180
  • Technical Data
  • Lead free
  • yes
  • PCB size
  • max. 180 x 120 mm
  • Clearance for assemblies
  • max. 25 mm
  • Heating controlling
  • microprozessor controlled
  • Heat distribution
  • Infrared heating element
  • Solder temperatures
  • 50 - 250 °C
  • Solder process time
  • ca. 4 - 8 min
  • Rated power
  • max. 600 W
  • Features
  • built in automatic air cooling fan
  • Power requirements
  • 220 VAC / 50Hz
  • Dimension and wight
  • 300 x 250 x 160mm / ca.18 kg

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subject to technical alteration
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