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RK300 Reflow oven    Reflow oven   
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Reflow oven RK300



  • Reflow oven RK300
  • Technical Data
  • Lead free
  • yes
  • PCB size
  • max. 320 x 300 mm
  • Clearance for assemblies
  • max. 35 mm
  • Heating controlling
  • microprozessor controlled
  • Heat distribution
  • infrared heating
  • Solder temperatures
  • 50 - 250 °C
  • Solder process time
  • ca. 4 - 8 min per board
  • Rated power
  • max. 3000 W
  • Features
  • Built in automatic air cooling fan
  • Power requirements
  • 220 VAC / 50Hz
  • Dimension and wight
  • 420 x 360 x 290mm / ca.30 kg

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subject to technical alteration
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