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RK360 Reflow oven    Reflow oven   
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Reflow oven RK360



  • Reflow oven RK360
  • Technical Data
  • Lead free
  • yes
  • Heating area
  • max. 330 x 220 mm
  • Clearance for assemblies
  • max. 35 mm
  • Heating controlling
  • Programmable 20 zone control for temperature curve setting
  • Heat distribution
  • high power heating element with force air heating method
  • Cooling
  • Dual channel air circulation for fast cool down process
  • Heating temperatures
  • 30 - 300 °C
  • Soldering process time
  • ca. 4 - 5 min per cycle of 300x200 mm PCB
  • Rated power
  • max. 3500 W / typ. 1200 W
  • Features
  • cost effective soldering process
  • stores up to three profiles
  • fully automatic, fully static ( non moving rail ) operation
  • for single or double side board soldering
  • large transparent glass window see trought the soldering process with hight temperature build in 35 W light
  • Power requirements
  • 220 VAC / 50Hz
  • Dimension and wight
  • 565 x 600 x 500mm / ca.50 kg

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subject to technical alteration
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