D1
manual dispenser
D10
automatic dispensing system with vision
D20
automatic dispensing system with vision
D30-H
Jet dispensing system with vision
D30-L
Jet dispensing system with vision
D40-H
Dispensing system with vision
D40-L
Dispensing system with vision
How to choose the right dispensing system
Choose the dispenser by material viscosity, required dot size, dispensing speed, process repeatability and whether contact or non-contact dispensing is needed. Camera systems, calibration functions and the correct dispensing valve configuration are especially important when working with small dots, fine structures or demanding SMT materials.
Frequently asked questions
What is a dispenser used for in electronics production?
A dispenser applies solder paste, adhesives, fluxes, thermal interface materials, conductive media and other technical fluids onto PCBs or other substrates. It is used when the process requires controlled, repeatable and localized material application.
What is the difference between contact and non-contact dispensing?
In contact dispensing, the medium is applied through a needle close to the surface. Non-contact dispensing ejects the material without touching the PCB, which can be faster and safer for delicate, uneven or densely populated surfaces.
When should non-contact dispensing be used?
Non-contact dispensing is useful for high dot counts, small volumes, high repeatability and applications where touching the surface could disturb the process. It is also helpful when speed and consistent dot geometry are important.
What is the difference between H and L dispenser versions?
H versions are intended for higher-viscosity media, while L versions are optimized for lower-viscosity media. This helps match the dispensing valve and process behavior to the material used in production.
Can one dispenser work with different materials?
Yes, depending on the selected configuration and valve setup, dispensers can process solder paste, adhesives, thermal pastes, conductive materials and other technical media used in electronics manufacturing.